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June 2000

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Subject:
From:
"Brad L. Matthies" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 20 Jun 2000 17:57:41 -0500
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Is Tg (either one) also a good way to control board flex through a reflow oven?  We are
looking at options to control board flex and have heard that this is one way to do
that.  Has anyone tried this and if so what were your interpretations?

Brad M.

LI YUAN wrote:

> Dear Technetters,
>
> There are normally TWO glass transition temperatures in material
> datasheets: Tg(TMA) and Tg(DMA).  In general, Tg(DMA) is higher than
> Tg(TMA) (like 30 - 50 C higher). Which one should a user use?
>
> Thanks,
>
> Yuan Li
>
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