James,

1. Pick the right component manufacturer
Does your component manufacturer have a quality system? Do
they actively measure their process parameters? Those component
manufacturers in control of their processes tend to have high
quality under bump metallurgy (UBM).

2. Have your flip chip bumped during the die manufacturing process
Will reduce handling exposure, eliminating a potential stressor

3. Pick the right underfill
The right combination of material properties will greatly improve the
lifetime of your flipchip component

4. Avoid board flexure at all cost
In my experience, the overwhelming majority of failures in flipchip
components is due to board flexure. Have tight tolerances in
regards to bow and twist. Review handling procedures to ensure no
bending of the board. Make sure the board is well supported during
any connector insertion steps.





On 19 Jun 00, at 15:20, Terveen, James @ NARDAEAST wrote:

> We are in the process possibly using a number of flipchip components
> on a new design.  I know that a number of you out there have used them
> already. Just was wondering what pit falls I may not want to fall into
> or just an overall do's and don'ts when it come to using them... Thank
> in advance
>
> ##############################################################
> TechNet Mail List provided as a free service by IPC using LISTSERV
> 1.8c ############################################################## To
> subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in the body: To subscribe:   SUBSCRIBE TECHNET <your
> full name> To unsubscribe:   SIGNOFF TECHNET
> ############################################################## Please
> visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
> information. If you need assistance - contact Keach Sasamori at
> [log in to unmask] or 847-509-9700 ext.5315
> ##############################################################


Dr. Craig Hillman
CALCE Electronic Products and Systems Consortium
University of Maryland
College Park, MD  20742
(301)-405-5316
[log in to unmask]

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################