For NEBS compliance, we have been advised by a consultant to add this
note to our fab drawings:
* Material must be thermal resistant to 150 degrees C.
We have also been advised to switch from LPI soldermask to dry film to
resist cracking which has been seen to happen after a few years.
What are your experiences with these 2 issues? Do we really need to do
this? I'm concerned about needlessly adding cost to our fabs. Any feedback
would be appreciated.

********************
Alexis Meehan
[log in to unmask]
LuxN, Inc.
570 Maude Court
Sunnyvale, CA 94086
"The Optical Renaissance Has Begun."
http://www.LuxN.com

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