Ken,

The magic number we use here for autoinsertion purposes is .014" over lead
size. I am sure someone here will come up with the magical number according
to an official source.

Richard Hamilton
Clemar Mfg. / Rain Bird
[log in to unmask]

> -----Original Message-----
> From: Ken Patel [SMTP:[log in to unmask]]
> Sent: Friday, June 16, 2000 11:02 AM
> To:   [log in to unmask]
> Subject:      [TN] component Hole dia v/s lead dia for better solder
> fillet
>
> Guys,
> It was told to us by our assembly house that PTH/component lead ratio is
> too
> tight for good solder fillet and to avoid solder depression (hole is not
> being completely filled up). I can see there is no de-wetting either on
> wall
> or the pin after cross-section.
>
> I want to know what that magic number should be. I believe that clearance
> or
> the gap between pin and hole - what is the minimum clearance recommenced
> and
> what should be maximum clearance for better solder fillet.
>
> Is this information available on any IPC document? I have read it but
> can't
> remember now.
>
> re,
> ken patel
>
>
> The boards I've seen after cleaning look acceptable. The fact that
> the holes are not completely filled can also be caused by improper
> PTH/component lead ratio. I suggest increasing the PTH diameter to
> alleviate
> the insufficient fill.
> ______________________________________________________
> Ken Patel                       Phone:  (408) 490-6804
> 1708 McCarthy Blvd.             Fax:    (408) 490-6859
> Milpitas, CA 95035
>
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