In a message dated 06/16/2000 12:52:19 PM Central Daylight Time,
[log in to unmask] writes:

<< hankyou for responding.

 That's close but, not quite right.  This device has 17 leads, DIL-bent_SIL
 power package.
 The spec sheet also seems to have a large pad in the component body center
 with 1 horse
 shoe indentation on each end of the componenT.
  >>

Hi again Greg!

From looking at the drawing the large pad on the back of the device looks to
me like it's for heat dissipation, and the two "U" shaped areas on either
side is to be able to mount a heatsink to the device. You would put some
thermal transfer compound on the back of the package and then mount the heat
sink to it...if it really needs one. The part may or may not need a heatsink
depending what is actually going on with the part. The drawing is just of the
package.

I don't think Philips carries heatsinks, if it does need one, you would get
that from
another vendor.

-Steve Gregory-

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