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June 2000

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Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 16 Jun 2000 13:53:17 EDT
Content-Type:
text/plain
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In a message dated 06/16/2000 9:21:57 AM Central Daylight Time,
[log in to unmask] writes:

<< Does anyone know where to locate a recommended land pattern for a SOT243-1
 (ref: Phillips)

 Thankyou >>

Hi Greg!

This package looks to me like a through-hole "ZIP DRAM" type of package...
Go to: http://www.phillips.semiconductors.com/package/SOT243-1

There's an outline drawing of the package there. It's a 17-pin device so you
would layout two rows of holes, 9 one row, 8 on the other row, 5.08mm between
the rows, with each hole on 2.54mm centers, and then position each row so
that the holes will zig-zag from each other. Like below:

    O O O O O O O O O
      O O O O O O O O

-Steve Gregory-

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