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June 2000

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Subject:
From:
"Jason Larson, AScT" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 16 Jun 2000 10:43:38 -0700
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text/plain (23 lines)
Hi Technet, I need to know what problems could arise over time if the solder
fill on a plated thru hole is less than 75%.

All the modules that exhibit this visible defect pass functional parameter
testing at room temp.

Thanks for any help
Jason

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