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June 2000

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Subject:
From:
"Howieson, Rick" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 16 Jun 2000 08:08:00 -0600
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Ron,
We have been using direct metalization for 5 years now. It has been
accepted by the Department of Defense and NASA. You should be able to
get  technical data from Shipley or ElectroChemical.
Rick
>-----Original Message-----
>From:  Ronald Yanuszewski [SMTP:[log in to unmask]]
>Sent:  Thursday, June 15, 2000 5:45 PM
>To:    [log in to unmask]
>Subject:       [TN] Direct Metalization
>
>All:
>
>One of our PCB suppliers would like us to qualify their direct metalization
>process, Shipley-Ronal Conductron.  Being from the not so young school of
>electroless, I have not embraced the direct plate process.  Any opinions,
>test data or anecdotal information as to the pros and cons would be greatly
>appreciated.
>
>Ron
><!DOCTYPE HTML PUBLIC "-//W3C//DTD HTML 4.0 Transitional//EN">
><HTML><HEAD>
><META content="text/html; charset=iso-8859-1" http-equiv=Content-Type>
><META content="MSHTML 5.00.2614.3500" name=GENERATOR>
><STYLE></STYLE>
></HEAD>
><BODY bgColor=#ffffff>
><DIV><FONT face=Arial size=2>All:</FONT></DIV>
><DIV>&nbsp;</DIV>
><DIV><FONT face=Arial>One of our PCB suppliers would like us to qualify their
>direct metalization process, Shipley-Ronal Conductron.&nbsp; Being from the
>not
>so young school of electroless, I have not embraced the direct plate
>process.&nbsp; Any opinions, test data or anecdotal&nbsp;information as to
>the
>pros and cons would be greatly appreciated.</FONT></DIV>
><DIV>&nbsp;</DIV>
><DIV><FONT face=Arial>Ron</FONT></DIV></BODY></HTML>

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