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June 2000

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Subject:
Stencil Guidelines
From:
Jack Crawford <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 1 Jun 2000 17:26:42 -0500
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text/plain (48 lines) 
The subject of stencil design comes up periodically on TechNet.  I don't often post new release info on TechNet, but this particular document is likely to have broad interest.  Jack

IPC-7525 Stencil Design Guidelines

This new document provides guides for the design and fabrication of stencils for solder paste and surface-mount adhesive.  This is the first time this important information has been collected and published in an industry consensus document.  Stencil design for various surface-mount technology, as well as mixed technology with through-hole or flip chip components is discussed; this includes overprint, two-print and step stencil designs.  A sample stencil order form and a user inspection checklist are also included.

20 pages
Release Date:  May 2000

Prices (IPC Members):
Hardcopy - $15
Electronic version:
Single-User - $23

Prices (Nonmembers):
Hardcopy - $30
Electronic version:
Single-User - $46

To order contact IPC Customer Service at 847.790.5362 or through our web site bookstore at www.ipc.org 



==========================================
APEX - the industry's premier trade show in Electronics
Manufacturing, January 16-18, 2001, San Diego, California.
More information on website www.apex2001.org
--------
Jack Crawford, IPC Director of Assembly Standards and Technology
2215 Sanders Road, Northbrook IL  60062-6135
[log in to unmask] 
847-790-5393
fax 847-509-9798

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