Why is it the lower the applied voltage across the anode and cathode the
better in an acid copper plating bath. It seems that the throwing power
is greater, but I am not sure? P=VI I is fixed the lower the I, means
the lower the power drawn. What does it do with the throwing power? How
about in a Tin-lead plating bath? We are using the Rapid power supplies
and the Macdermid 9241 plating bath.

THANKS IN ADVANCE!!!!!!

Francis

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