Alan,

The problem with direct metallization of flat non-conductors is the "knit
rate" of copper to carry forward a conductive film.  There are issues of
inputing enough current to plate copper without causing the "burning" or
dissolution of the direct metallization on the flat dielectric areas.

I suspect that all direct metallization suppliers have their own secrets to
accomplish what you ask, but the process is not accepted commercially, so far
as I know.  Again, contact off line to point you in the right direction of
chemistry/equipment combinations that may be able to accomplish your task -

Dennis Fritz
MacDermid, Inc
203-575-5740

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