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June 2000

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Subject:
From:
Nancy Trumbull <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 15 Jun 2000 07:26:28 -0400
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George,
I'm sorry to say I have no idea on the target thickness for both metals.  All of our information is in Japanese right now being translated.
I just heard this morning that nothing really matters because it was already approved in Japan.  Now that worries me even more.  
 I still want everyone to  input on this. Sorry I have no real  information.  I understand that you can  only give possible scenarios.
By the way George about adding a thin layer of Au to the Ni. Wouldn't the supplier know to do this?  Or would this be one of those items that our Japan plant  should have asked at the time.  Do you believe that the supplier would make this with or with a thin layer of Au?
Boy I hope our plant in japan had all the information they needed.
Thanks for the head up
Nancy T
 
>>> [log in to unmask] 06/14/00 04:36PM >>>
Nancy,
What is the target thickness for both metals in your application? the Pd and
the Ni replacement?
If you are going to solder the parts, then Ni would not necssarily be a good
candidate, as it has a tendency to oxidize and passivate. It will eventually
be difficult to solder to, as George Wenger has stated.
Plating a thin layer of Au 2- 4 micoinches would preserve the Ni and keep it
solderable.
George Milad
Shipley Co
Freeport NY
(516)868-8800 X269

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