Fellow tech netters,

               I am trying to setup some pull test specs for our expoxy
process, we currently using a DEK screen printer and a FUJI FGL2 to
dispense glue. Does any one know what are the pull test (in pounds) for the
different components (example 0805, 1206, Tantalums, etc)?. I have found
that the only way of knowing if a populated board with glue is going to
withstand the handling is by having a pull test as a process measurement.
Any ideas?

               Thanks


Jorge Rodriguez
Process Engineer
Conexant Systems

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