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June 2000

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Subject:
From:
Bernhard Wanner <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 14 Jun 2000 18:47:59 +0200
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text/plain
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text/plain (26 lines)
Hi Steve

If it’s a hi-rel application and humidity will be a topic you can’t prevent
resist flake off during application. This means you will get caverns and
this means also electromigration problems, because any humidity will diffuse
througt the conformal coating and condense (during temperature decreasing).
Best way would be to peel away the resist.

Regards

Bernhard (ex-Melcher-qms-guru)

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