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June 2000

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Subject:
From:
Gerry Cooper <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 14 Jun 2000 07:39:10 -0400
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Many years ago all circuit boards were plated with 100 U of gold directly over
copper.  This changed to 50 u when nickel was added, and later went down to 30
u.  The problem is that copper migrates up through the gold if it is not thick
enough, the nickel acts as a barrier layer.

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