TECHNET Archives

June 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Remi Charron <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 14 Jun 2000 07:55:38 -0400
Content-Type:
multipart/mixed
Parts/Attachments:
text/plain (665 bytes) , remichar.vcf (339 bytes)

Dear Technetters,

In IPC-2221 "Generic Standard on Printed Board Design" the following is
said about blind vias "Blind via holes should be filled or plugged with
a polymer or solder resist to prevent solder from entering them as
solder in the small holes decreases reliability".

This is the first time I hear about the reliability of the blind via's
going down with the introduction of solder in the hole. Does anyone have

more information about this decrease in reliability? (i.e. know of
testing done in this area, or have witnessed something to that effect)
Would connecting BGA's to blind vias constitute filling the hole, hence
reducing its reliability?

Thanks,

Remi Charron


ATOM RSS1 RSS2