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June 2000

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Subject:
From:
Ryan Grant <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 13 Jun 2000 16:48:52 -0600
Content-Type:
text/plain
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text/plain (73 lines)
Hi Roger,
        Gold dissolves pretty fast into copper.  Even at room temperature.
I doubt the flex could make it from fab to assembly fast enough for the gold
to still be on the surface of the copper.  (I certainly wouldn't want to try
soldering to it.)

Thanks

Ryan Grant
Advanced Technology Engineer
MCMS
(208) 898-1145
[log in to unmask]


> -----Original Message-----
> From: Roger M. Stoops [SMTP:[log in to unmask]]
> Sent: Tuesday, June 13, 2000 4:19 PM
> To:   [log in to unmask]
> Subject:      [TN] Gold over Copper?!?
>
> I am losing my mind...
>
> I have just been asked to specify a flex circuit to have 3-5u in of gold
> directly on the copper.  (That's right folks, no nickel!)
> This might be okay if a few parts were being soldered in place,  but one
> end of the flex is for a FPC connector (also gold plated).
> Is this a good idea?  Your comments, please, please, PLEASE!
> Or else I am losing my mind...  hey, where did I put my mi...
>
> Sincerely, Lost One
>
>  Roger M. Stoops,       PCB Designer
>
>  Spectra Precision Inc. Ph:     937.233.8921
>  5475 Kellenburger Rd.     937.233.4574 ext
>  Dayton, OH 45424-1099  288
>  USA                    Fax:    937.233.7511
>
>                         Member IPC
>                         Designer's Council,
>                         C.I.D.
>
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