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June 2000

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Subject:
Re: Scaling on PBGA Balls after reflow.
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 13 Jun 2000 08:21:54 -0500
Content-Type:
multipart/mixed
Parts/Attachments:
text/plain (1072 bytes) , david.simmons.vcf (366 bytes) 

Hi Dave! Is it possible to get a electronic photo which you could send out
directly to the TechNetees? Scaling could be partial reflow of the solder
but without seeing what you are seeing we will be guessing.

Dave Hillman
Rockwell Collins
[log in to unmask]





Dave Simmons <[log in to unmask]>@IPC.ORG> on 06/12/2000 03:28:45 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to Dave Simmons <[log in to unmask]>

Sent by:  TechNet <[log in to unmask]>


To:   [log in to unmask]
cc:

Subject:  [TN] Scaling on PBGA Balls after reflow.


Hi All,

We are checking placement of some PBGA's. I have an ERSAScope on a demo,
and when viewing the solder balls/joints of the BGA there is some
"scaling" on the surface of the ball.
I was wondering what this scaling is a function of (e.g. to rapid
cooling, not hot enough, to hot during reflow?), and is it a defect I
should be worried about. I am not seeing this "scaling" on any of the
other parts (QFP100, 0603 chips) on the board.
Can anyone offer any advice?
Thanks
David

(See attached file: david.simmons.vcf)

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