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June 2000

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Subject:
Scaling on PBGA Balls after reflow.
From:
Dave Simmons <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 13 Jun 2000 08:28:45 +1200
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Hi All,

We are checking placement of some PBGA's. I have an ERSAScope on a demo,
and when viewing the solder balls/joints of the BGA there is some
"scaling" on the surface of the ball.
I was wondering what this scaling is a function of (e.g. to rapid
cooling, not hot enough, to hot during reflow?), and is it a defect I
should be worried about. I am not seeing this "scaling" on any of the
other parts (QFP100, 0603 chips) on the board.
Can anyone offer any advice?
Thanks
David

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