Hi Jim,

What is your hole and lead diameter?  We've had the
same problem and we discovered that the difference
between the two was almost three times the maximum
suggested in IPC-D-275.

The difference between the maximum hole to minimum
lead diameter should not be over 0.032".

Hope that answer your question.

JF

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Dieselberg, Ron
> Sent: Monday, June 12, 2000 8:57 AM
> To: [log in to unmask]
> Subject: Re: [TN] Solder Fill
>
>
> Just a quick guess since I don't know all of the details, but
> maybe the lead
> to hole ratio is not proper. Like small lead, big hole. The thru
> hole gurus
> can give you the exact ratios I am sure.
> Ron Dieselberg
>
> -----Original Message-----
> From: Jim Gilbert [mailto:[log in to unmask]]
> Sent: Friday, June 09, 2000 09:03
> To: [log in to unmask]
> Subject: [TN] Solder Fill
>
>
> Technetters,
>
> We have a customer that is touching up the assembly after wave solder.
>  This touch up is to improve the aesthetics on holes which have not
> completely wicked up on the lead.  We have explained to him that
> this isn't
> necessary and he is probably doing more damage than good, however this
> isn't the issue.  The issue is that when he pulls the soldering iron away
> from the hole the solder appears to fall through the hole and wick on the
> component lead on the opposite side.  We have done cross
> sectional analysis
> to ensure the holes aren't voided and the solder isn't being pulled in.
>  Sections look good with a consistent ounce of plating in the holes.  I am
> unsure of what the hole sizes are that he's having problems with, but
> obviously something is awry with the solder "falling out".  Any ideas on
> what cause may be?
>
> Thanks in advance for your help.
>
> Jim Gilbert
> Electronic Circuits & Design
> Sebring, Ohio
>
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