Been away from TechNet for a few days, and my my my, how it fills up with
postings!  This is good!

Bruce - I agree with you, increasing temp is the easiest thing to do, if the
package will take it.  I have taken thermosonic ball bonding almost up to
thermocompression temperatures (300-325°C) for some troublesome parts.

Given a choice, I would rather theromosonic gold wedge bond than ball bond
because I can generally create a good bond with less force/unit area with
the wedge bonder than I can with a ball bonder.  I give up flexibility and
speed though.

I am sure there are as 'many ways to skin this critter' as there are people
with bonders, however.

Steve Creswick


At 11:58 AM 6/8/00 +0200, you wrote:
>Thanks for reply. Especially to Steve and Bruce. The sum of your experience
in the game is such that I will screw down the EFO matter a little and
concentrate on cratering and thermocompression trials. If you calculate (I
havn't done) the energy of a millisecond induced voltage 15mms far from the
source (the EFO), induced in proportion to the length of the receipient (the
"coil"), I guess the energy will be so few picowatts, that a PN-junction
will not die even if there is a primary breakdown. Some people think that
too high a reversed junction will always be killed, but it's also a question
of energy, not only voltage. The more I think about it the more I doubt
about EFO chip-murderers.
>
>A risk: I may come back to you if the chip killing goes on. Few chips die,
but they are extremly expensive. Repare is also an additional cost, so we
want an explanation soon.
>
>Ingemar
>
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