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June 2000

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Subject:
Re: Failure Rate for Reflow Process
From:
Ryan Grant <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 9 Jun 2000 11:23:19 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (66 lines) 
Alejandro,
        Please explain your definition of defect rate.  Is it solder shorts,
low volume solder, component misplacement, dead component, temperature
cycles to failure etc?

Thanks

Ryan Grant
Advanced Technology Engineer
MCMS
(208) 898-1145
[log in to unmask]



> -----Original Message-----
> From: Becerra Alejandro [SMTP:[log in to unmask]]
> Sent: Friday, June 09, 2000 8:17 AM
> To:   [log in to unmask]
> Subject:      [TN] Failure Rate for Reflow Process
>
> Good morning Technet members,
>
> I have a question about failure rates for reflow process.
> Can someone tell me if there is a benchmark failure rate for a QFP (20 mil
> pitch).
> It is soldered over a FR-4 board with HASL coating. The reflow ambient is
> nitrogen.
>
> Thanks
>
>
> Alejandro Becerra
> Phone (915)841-8518,  Fax (915)841-8401
> [log in to unmask]
>
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