Whoa! That's an awesome idea! Now I'm thinking of all the other
possibilities of using that technique.
Ryan Grant
Advanced Technology Engineer
MCMS
(208) 898-1145
[log in to unmask]
> -----Original Message-----
> From: Brian Ellis [SMTP:[log in to unmask]]
> Sent: Friday, June 09, 2000 2:07 AM
> To: [log in to unmask]
> Subject: Re: [TN] still confused
>
> OK, Ralph, I may have an answer which will satisfy everybody and provide a
> reliable
> solution. Buy some 50 micrometre rolled copper foil and have it
> electroplated on one
> side with, say 5 um Ni and 1 um Au. This would not be expensive. Stamp out
> contact-size
> disks. Put a drop of RMA or "no-clean" flux on the HASL contacts, place a
> disk onto it,
> gold side out, and heat until the HASL solder melts and the disk becomes
> +/- integral
> with the assembly. Et voila!
>
> Heating can be via focussed IR, thermode, hot gas or even, with care, a
> soldering iron.
>
> Brian
>
> Ralph Richart wrote:
>
> > We have answers....
> >
> > So I had a long talk with my customer this morning to provide input
> > based on the invaluable advice from you all.
> >
> > I said - "is there a specific reason for choosing 3-8u" of immersion
> > gold over tin/lead solder?"
> > He said - "absolutely, the gold provides corrosion resistance, the gold
> > does not"
> > I said - "even such a thin amount - only 3-8u"?"
> > He said - "definitely, all we need is the coverage, the thickness is
> > irrelevant"
> >
> > Is this true?
> >
> > Needless to say, we are rebuilding the parts as we speak. Rework sounds
> > difficult to say the least, although I may try to come up with some
> > scheme for fun as they have a bunch of boards that are no good right
> > now.
> >
> > thanks for all the help.....
> >
> > ralph
> >
> > PS - more on the larrylobster story later; it's more silly than anything
> > else. Paul's poem may soon become our own, however. Very funny!
> >
> > Off to build some boards....
> >
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