Technetters,

We have a customer that is touching up the assembly after wave solder.
 This touch up is to improve the aesthetics on holes which have not
completely wicked up on the lead.  We have explained to him that this isn't
necessary and he is probably doing more damage than good, however this
isn't the issue.  The issue is that when he pulls the soldering iron away
from the hole the solder appears to fall through the hole and wick on the
component lead on the opposite side.  We have done cross sectional analysis
to ensure the holes aren't voided and the solder isn't being pulled in.
 Sections look good with a consistent ounce of plating in the holes.  I am
unsure of what the hole sizes are that he's having problems with, but
obviously something is awry with the solder "falling out".  Any ideas on
what cause may be?

Thanks in advance for your help.

Jim Gilbert
Electronic Circuits & Design
Sebring, Ohio

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################