Ralph's a bro on same boat; still, good to see yo' raising guard Mike;
innocent tribal greeting mate, got it almost right
CG, likes watch battery pads due to minute currents don't like carbon
compounds resistivities,
on top myself i don't like the batch character variances as well, etc.
Refuse to soil TN with LF issues Mike
paul
-----Original Message-----
From: Keel, Mike [mailto:[log in to unmask]]
Sent: Friday, 9 June 2000 10:37
To: [log in to unmask]
Subject: Re: [TN] still confused
Hey Ralph
No Harm; No Foul.
However this does remind me of the lead free scenario being fried and
re-fried.
This guy SHOUTS :
THOSE GUYS ARE AT BEST - - MIS-GUIDED,
AT WORST
The Lead-free thing is being driven mostly by politicians in the
<developed> countries who are not concerned in the slightest that any
replacement to lead will probably cause more pollution in the mining and
refinement areas, i.e. third world countries than lead does.
Here's an idea -
before we insult the other guys' intellect and motives
we as a group realize there are MANY Issues, Ideas, Strategies, we may not
be directly aware of
and as a consequence
we may be using faulty logic or rational.
How does this group appear when we go after the innocent ? ? ?
still confused
cu mate, (all in good humor ok ?)
M Keel
-----Original Message-----
From: Ralph Richart [mailto:[log in to unmask]]
Sent: Friday, June 09, 2000 12:27 AM
To: [log in to unmask]
Subject: Re: [TN] still confused
Remember, I'm just a fab guy. To me, contacts mean gold
edge connectors. You design
guys never let us in on the "other things" you are calling
contacts! :-)
I hope I have not forever alientated myself from the technet
community! I was giving
info as soon as I got it and learning along the way. Please
forgive my ignorance.
Thanks for all the help and knowledge on this. I am back to
the plating tanks where I
can happily destroy all the brain cells of new information I
have learned in the last
day.
ralph
Paul Klasek wrote:
> Ralph , yoo bloody lobster, that's what i said right in
the beginning of
> this saga,
> THEY DO HAVE CONTACTS !
> Feeling for chef's potty immersion ?
>
> Heloooooooooo....Rick ; validated here 10umNi 0.5umAu for
1M cycles under
> touch pads
> with carbon loaded pills switching onto the board (as most
mobiles)
> So it does not erase that easy,
> that automated finger puncher simulator was going for
weeeks.
>
> And the same goes for battery pads or clamps,
> easier still as it's seated in one place .
> Validated on 5year contact . If it leaks it's totally
different story .
>
> Ralph go back to my & Steve's and get on with that grizzly
job.
> RioGrandes have both Ni & Au miniplating kits.
> You managed to confuse even Dave, that is an achievement .
>
> cu mate, (all in good humor ok ?)
paul
>
> -----Original Message-----
> From: Howieson, Rick [mailto:[log in to unmask]]
> Sent: Friday, 9 June 2000 8:33
> To: [log in to unmask]
> Subject: Re: [TN] still confused
>
> Bill,
> Helloooo....Ralph was talking about immersion gold NOT
hard
> electroplated gold as seen on connectors. Immersion gold
can easily be
> removed with an erasor, imagine what a corrosion from
battery leakage
> would do?
> Rick
>
> >-----Original Message-----
> >From: Brooks Bill [SMTP:[log in to unmask]]
> >Sent: Thursday, June 08, 2000 4:04 PM
> >To: [log in to unmask]
> >Subject: Re: [TN] still confused
> >
> >That's Different! He's absolutely correct! The gold
plating in THAT area
> >would be desirable, this is no different than a card edge
connector. If the
> >pad on the board is to act as a connector and they will
NOT be soldering to
> >it, I would highly recommend a gold over Ni surface. To
rework, can you
> >strip the solder from the pads and selective NI/gold
plate there... and
> >still protect the circuitry and components from contact
with the chemicals?
> >One alternative might be silver plating.... silver oxide
is still very
> >conductive... but I don't know if it's an option for the
company you are
> >dealing with...
> >
> >The risk of corrosion degrading the battery performance
has to do with the
> >contact of the battery to the pad on the board. Humidity
in the air can
> >condense between the nickel plating on the outside of the
battery and the
> >Tin/lead solder on the surface creating an electrolyte
between dissimilar
> >metals.... thus oxidation and corrosion will seep into
the contact area
> over
> >time, reducing the conductivity between the battery and
the board.
> >
> >
> >Bill Brooks
> >Senior PCB Designer - [log in to unmask]
<mailto:[log in to unmask]>
> >
> >Zoneworx, Inc.
> >40925 County Center Drive, STE 200
> >Temecula, CA 92591
> >http://www.zoneworx.com <http://www.zoneworx.com>
> >Tel: (909) 296-1226 x 1037
> >Co-Director / Education Officer / Webmaster
> >for the San Diego Chapter of the IPC Designers Council
> >http://www.ipc.org/SanDiego/index.html
> ><http://www.ipc.org/SanDiego/index.html>
> >
> >
> >
> >
> >
> >
> >-----Original Message-----
> >From: Ralph Richart [mailto:[log in to unmask]]
> >Sent: Thursday, June 08, 2000 2:33 PM
> >To: [log in to unmask]
> >Subject: Re: [TN] still confused
> >
> >
> >So here's the deal:
> >
> >They have two large circular pads (like about .750") that
they use as
> >battery
> >contacts. He says that this is the place that he has
corrosion risk. I
> >can't tell if
> >the corrosion risk is from battery leakage or
environmental effects.
> >Anyway, he says
> >that corrosion significantly impacts the battery life.
> >
> >ralph
> >
> >David Hillman wrote:
> >
> >> Hi Ralph! Can you provide more information on what the
customer
> >> considers/experienced "corrosion" and what type of use
environment he/she
> >> was talking about?
> >>
> >> Dave Hillman
> >> Rockwell Collins
> >> [log in to unmask]
> >>
> >> Ralph Richart <[log in to unmask]>@IPC.ORG> on
06/08/2000 11:55:26 AM
> >>
> >> Please respond to "TechNet E-Mail Forum."
<[log in to unmask]>; Please
> >respond
> >> to Ralph Richart <[log in to unmask]>
> >>
> >> Sent by: TechNet <[log in to unmask]>
> >>
> >> To: [log in to unmask]
> >> cc:
> >>
> >> Subject: [TN] still confused
> >>
> >> We have answers....
> >>
> >> So I had a long talk with my customer this morning to
provide input
> >> based on the invaluable advice from you all.
> >>
> >> I said - "is there a specific reason for choosing 3-8u"
of immersion
> >> gold over tin/lead solder?"
> >> He said - "absolutely, the gold provides corrosion
resistance, the gold
> >> does not"
> >> I said - "even such a thin amount - only 3-8u"?"
> >> He said - "definitely, all we need is the coverage, the
thickness is
> >> irrelevant"
> >>
> >> Is this true?
> >>
> >> Needless to say, we are rebuilding the parts as we
speak. Rework sounds
> >> difficult to say the least, although I may try to come
up with some
> >> scheme for fun as they have a bunch of boards that are
no good right
> >> now.
> >>
> >> thanks for all the help.....
> >>
> >> ralph
> >>
> >>
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