Relax man ; keep the neurons and don't destroy the cards;
yo' safe in US, aliens are outside , hahaha ,
especially SOB - really down under
paul
-----Original Message-----
From: Ralph Richart [mailto:[log in to unmask]]
Sent: Friday, 9 June 2000 9:27
To: [log in to unmask]
Subject: Re: [TN] still confused
Remember, I'm just a fab guy. To me, contacts mean gold edge connectors.
You design
guys never let us in on the "other things" you are calling contacts! :-)
I hope I have not forever alientated myself from the technet community! I
was giving
info as soon as I got it and learning along the way. Please forgive my
ignorance.
Thanks for all the help and knowledge on this. I am back to the plating
tanks where I
can happily destroy all the brain cells of new information I have learned in
the last
day.
ralph
Paul Klasek wrote:
> Ralph , yoo bloody lobster, that's what i said right in the beginning of
> this saga,
> THEY DO HAVE CONTACTS !
> Feeling for chef's potty immersion ?
>
> Heloooooooooo....Rick ; validated here 10umNi 0.5umAu for 1M cycles under
> touch pads
> with carbon loaded pills switching onto the board (as most mobiles)
> So it does not erase that easy,
> that automated finger puncher simulator was going for weeeks.
>
> And the same goes for battery pads or clamps,
> easier still as it's seated in one place .
> Validated on 5year contact . If it leaks it's totally different story .
>
> Ralph go back to my & Steve's and get on with that grizzly job.
> RioGrandes have both Ni & Au miniplating kits.
> You managed to confuse even Dave, that is an achievement .
>
> cu mate, (all in good humor ok ?) paul
>
> -----Original Message-----
> From: Howieson, Rick [mailto:[log in to unmask]]
> Sent: Friday, 9 June 2000 8:33
> To: [log in to unmask]
> Subject: Re: [TN] still confused
>
> Bill,
> Helloooo....Ralph was talking about immersion gold NOT hard
> electroplated gold as seen on connectors. Immersion gold can easily be
> removed with an erasor, imagine what a corrosion from battery leakage
> would do?
> Rick
>
> >-----Original Message-----
> >From: Brooks Bill [SMTP:[log in to unmask]]
> >Sent: Thursday, June 08, 2000 4:04 PM
> >To: [log in to unmask]
> >Subject: Re: [TN] still confused
> >
> >That's Different! He's absolutely correct! The gold plating in THAT area
> >would be desirable, this is no different than a card edge connector. If
the
> >pad on the board is to act as a connector and they will NOT be soldering
to
> >it, I would highly recommend a gold over Ni surface. To rework, can you
> >strip the solder from the pads and selective NI/gold plate there... and
> >still protect the circuitry and components from contact with the
chemicals?
> >One alternative might be silver plating.... silver oxide is still very
> >conductive... but I don't know if it's an option for the company you are
> >dealing with...
> >
> >The risk of corrosion degrading the battery performance has to do with
the
> >contact of the battery to the pad on the board. Humidity in the air can
> >condense between the nickel plating on the outside of the battery and the
> >Tin/lead solder on the surface creating an electrolyte between dissimilar
> >metals.... thus oxidation and corrosion will seep into the contact area
> over
> >time, reducing the conductivity between the battery and the board.
> >
> >
> >Bill Brooks
> >Senior PCB Designer - [log in to unmask] <mailto:[log in to unmask]>
> >
> >Zoneworx, Inc.
> >40925 County Center Drive, STE 200
> >Temecula, CA 92591
> >http://www.zoneworx.com <http://www.zoneworx.com>
> >Tel: (909) 296-1226 x 1037
> >Co-Director / Education Officer / Webmaster
> >for the San Diego Chapter of the IPC Designers Council
> >http://www.ipc.org/SanDiego/index.html
> ><http://www.ipc.org/SanDiego/index.html>
> >
> >
> >
> >
> >
> >
> >-----Original Message-----
> >From: Ralph Richart [mailto:[log in to unmask]]
> >Sent: Thursday, June 08, 2000 2:33 PM
> >To: [log in to unmask]
> >Subject: Re: [TN] still confused
> >
> >
> >So here's the deal:
> >
> >They have two large circular pads (like about .750") that they use as
> >battery
> >contacts. He says that this is the place that he has corrosion risk. I
> >can't tell if
> >the corrosion risk is from battery leakage or environmental effects.
> >Anyway, he says
> >that corrosion significantly impacts the battery life.
> >
> >ralph
> >
> >David Hillman wrote:
> >
> >> Hi Ralph! Can you provide more information on what the customer
> >> considers/experienced "corrosion" and what type of use environment
he/she
> >> was talking about?
> >>
> >> Dave Hillman
> >> Rockwell Collins
> >> [log in to unmask]
> >>
> >> Ralph Richart <[log in to unmask]>@IPC.ORG> on 06/08/2000 11:55:26
AM
> >>
> >> Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please
> >respond
> >> to Ralph Richart <[log in to unmask]>
> >>
> >> Sent by: TechNet <[log in to unmask]>
> >>
> >> To: [log in to unmask]
> >> cc:
> >>
> >> Subject: [TN] still confused
> >>
> >> We have answers....
> >>
> >> So I had a long talk with my customer this morning to provide input
> >> based on the invaluable advice from you all.
> >>
> >> I said - "is there a specific reason for choosing 3-8u" of immersion
> >> gold over tin/lead solder?"
> >> He said - "absolutely, the gold provides corrosion resistance, the gold
> >> does not"
> >> I said - "even such a thin amount - only 3-8u"?"
> >> He said - "definitely, all we need is the coverage, the thickness is
> >> irrelevant"
> >>
> >> Is this true?
> >>
> >> Needless to say, we are rebuilding the parts as we speak. Rework
sounds
> >> difficult to say the least, although I may try to come up with some
> >> scheme for fun as they have a bunch of boards that are no good right
> >> now.
> >>
> >> thanks for all the help.....
> >>
> >> ralph
> >>
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