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June 2000

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Subject:
From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 9 Jun 2000 08:57:40 +1000
Content-Type:
text/plain
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text/plain (209 lines)
Ralph , yoo bloody lobster, that's what i said right in the beginning of
this saga,
THEY DO HAVE CONTACTS !
Feeling for chef's potty immersion ?

Heloooooooooo....Rick ; validated here 10umNi 0.5umAu for 1M cycles under
touch pads
with carbon loaded pills switching onto the board (as most mobiles)
So it does not erase that easy,
that automated finger puncher simulator was going for weeeks.

And the same goes for battery pads or clamps,
easier still as it's seated in one place .
Validated on 5year contact . If it leaks it's totally different story .

Ralph go back to my & Steve's and get on with that grizzly job.
RioGrandes have both Ni & Au miniplating kits.
You managed to confuse even Dave, that is an achievement .

cu mate, (all in good humor ok ?)                            paul



-----Original Message-----
From: Howieson, Rick [mailto:[log in to unmask]]
Sent: Friday, 9 June 2000 8:33
To: [log in to unmask]
Subject: Re: [TN] still confused


Bill,
Helloooo....Ralph was talking about immersion gold NOT hard
electroplated gold as seen on connectors. Immersion gold can easily be
removed with an erasor, imagine what a corrosion from battery leakage
would do?
Rick

>-----Original Message-----
>From:  Brooks Bill [SMTP:[log in to unmask]]
>Sent:  Thursday, June 08, 2000 4:04 PM
>To:    [log in to unmask]
>Subject:       Re: [TN] still confused
>
>That's Different! He's absolutely correct! The gold plating in THAT area
>would be desirable, this is no different than a card edge connector. If the
>pad on the board is to act as a connector and they will NOT be soldering to
>it, I would highly recommend a gold over Ni surface. To rework, can you
>strip the solder from the pads and selective NI/gold plate there... and
>still protect the circuitry and components from contact with the chemicals?
>One alternative might be silver plating.... silver oxide is still very
>conductive... but I don't know if it's an option for the company you are
>dealing with...
>
>The risk of corrosion degrading the battery performance has to do with the
>contact of the battery to the pad on the board. Humidity in the air can
>condense between the nickel plating on the outside of the battery and the
>Tin/lead solder on the surface creating an electrolyte between dissimilar
>metals.... thus oxidation and corrosion will seep into the contact area
over
>time, reducing the conductivity between the battery and the board.
>
>
>Bill Brooks
>Senior PCB Designer - [log in to unmask] <mailto:[log in to unmask]>
>
>Zoneworx, Inc.
>40925 County Center Drive, STE 200
>Temecula, CA 92591
>http://www.zoneworx.com    <http://www.zoneworx.com>
>Tel: (909) 296-1226 x 1037
>Co-Director / Education Officer / Webmaster
>for the San Diego Chapter of the IPC Designers Council
>http://www.ipc.org/SanDiego/index.html
><http://www.ipc.org/SanDiego/index.html>
>
>
>
>
>
>
>-----Original Message-----
>From: Ralph Richart [mailto:[log in to unmask]]
>Sent: Thursday, June 08, 2000 2:33 PM
>To: [log in to unmask]
>Subject: Re: [TN] still confused
>
>
>So here's the deal:
>
>They have two large circular pads (like about .750") that they use as
>battery
>contacts.  He says that this is the place that he has corrosion risk.  I
>can't tell if
>the corrosion risk is from battery leakage or environmental effects.
>Anyway, he says
>that corrosion significantly impacts the battery life.
>
>ralph
>
>David Hillman wrote:
>
>> Hi Ralph! Can you provide more information on what the customer
>> considers/experienced "corrosion" and what type of use environment he/she
>> was talking about?
>>
>> Dave Hillman
>> Rockwell Collins
>> [log in to unmask]
>>
>> Ralph Richart <[log in to unmask]>@IPC.ORG> on 06/08/2000 11:55:26 AM
>>
>> Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please
>respond
>>       to Ralph Richart <[log in to unmask]>
>>
>> Sent by:  TechNet <[log in to unmask]>
>>
>> To:   [log in to unmask]
>> cc:
>>
>> Subject:  [TN] still confused
>>
>> We have answers....
>>
>> So I had a long talk with my customer this morning to provide input
>> based on the invaluable advice from you all.
>>
>> I said - "is there a specific reason for choosing 3-8u" of immersion
>> gold over tin/lead solder?"
>> He said - "absolutely, the gold provides corrosion resistance, the gold
>> does not"
>> I said - "even such a thin amount - only 3-8u"?"
>> He said - "definitely, all we need is the coverage, the thickness is
>> irrelevant"
>>
>> Is this true?
>>
>> Needless to say, we are rebuilding the parts as we speak.  Rework sounds
>> difficult to say the least, although I may try to come up with some
>> scheme for fun as they have a bunch of boards that are no good right
>> now.
>>
>> thanks for all the help.....
>>
>> ralph
>>
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> << File: Bill Brooks.vcf >>

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