I think we are all going to agree with you Bill
Ryan Grant
> -----Original Message-----
> From: Brooks Bill [SMTP:[log in to unmask]]
> Sent: Thursday, June 08, 2000 4:04 PM
> To: [log in to unmask]
> Subject: Re: [TN] still confused
>
> That's Different! He's absolutely correct! The gold plating in THAT area
> would be desirable, this is no different than a card edge connector. If
> the
> pad on the board is to act as a connector and they will NOT be soldering
> to
> it, I would highly recommend a gold over Ni surface. To rework, can you
> strip the solder from the pads and selective NI/gold plate there... and
> still protect the circuitry and components from contact with the
> chemicals?
> One alternative might be silver plating.... silver oxide is still very
> conductive... but I don't know if it's an option for the company you are
> dealing with...
>
> The risk of corrosion degrading the battery performance has to do with the
> contact of the battery to the pad on the board. Humidity in the air can
> condense between the nickel plating on the outside of the battery and the
> Tin/lead solder on the surface creating an electrolyte between dissimilar
> metals.... thus oxidation and corrosion will seep into the contact area
> over
> time, reducing the conductivity between the battery and the board.
>
>
> Bill Brooks
> Senior PCB Designer - [log in to unmask] <mailto:[log in to unmask]>
>
> Zoneworx, Inc.
> 40925 County Center Drive, STE 200
> Temecula, CA 92591
> http://www.zoneworx.com <http://www.zoneworx.com>
> Tel: (909) 296-1226 x 1037
> Co-Director / Education Officer / Webmaster
> for the San Diego Chapter of the IPC Designers Council
> http://www.ipc.org/SanDiego/index.html
> <http://www.ipc.org/SanDiego/index.html>
>
>
>
>
>
>
> -----Original Message-----
> From: Ralph Richart [mailto:[log in to unmask]]
> Sent: Thursday, June 08, 2000 2:33 PM
> To: [log in to unmask]
> Subject: Re: [TN] still confused
>
>
> So here's the deal:
>
> They have two large circular pads (like about .750") that they use as
> battery
> contacts. He says that this is the place that he has corrosion risk. I
> can't tell if
> the corrosion risk is from battery leakage or environmental effects.
> Anyway, he says
> that corrosion significantly impacts the battery life.
>
> ralph
>
> David Hillman wrote:
>
> > Hi Ralph! Can you provide more information on what the customer
> > considers/experienced "corrosion" and what type of use environment
> he/she
> > was talking about?
> >
> > Dave Hillman
> > Rockwell Collins
> > [log in to unmask]
> >
> > Ralph Richart <[log in to unmask]>@IPC.ORG> on 06/08/2000 11:55:26
> AM
> >
> > Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please
> respond
> > to Ralph Richart <[log in to unmask]>
> >
> > Sent by: TechNet <[log in to unmask]>
> >
> > To: [log in to unmask]
> > cc:
> >
> > Subject: [TN] still confused
> >
> > We have answers....
> >
> > So I had a long talk with my customer this morning to provide input
> > based on the invaluable advice from you all.
> >
> > I said - "is there a specific reason for choosing 3-8u" of immersion
> > gold over tin/lead solder?"
> > He said - "absolutely, the gold provides corrosion resistance, the gold
> > does not"
> > I said - "even such a thin amount - only 3-8u"?"
> > He said - "definitely, all we need is the coverage, the thickness is
> > irrelevant"
> >
> > Is this true?
> >
> > Needless to say, we are rebuilding the parts as we speak. Rework sounds
> > difficult to say the least, although I may try to come up with some
> > scheme for fun as they have a bunch of boards that are no good right
> > now.
> >
> > thanks for all the help.....
> >
> > ralph
> >
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