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June 2000

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Subject:
From:
"Phillips, Peter (NM05)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 8 Jun 2000 14:15:57 -0500
Content-Type:
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Donn,
You may want to start with the following AMP web site:
http://www.amp.com/products/technology/articles/dd66.stm

                          Honeywell
Peter A. Phillips, Sustaining Engineer
Manufacturing Engineering
Home and Building Controls
8500 Bluewater Road N.W.
Albuquerque, NM 87121-1958
Pho     505-831-7509
Fax     505-836-4834
[log in to unmask]


-----Original Message-----
From: Steffen, Don E [mailto:[log in to unmask]]
Sent: Thursday, June 08, 2000 12:31 PM
To: [log in to unmask]
Subject: [TN] PROCESS/DESIGN GUIDELINES FOR STENCILS


TECHNET

Does anybody have stencil/process design guidelines for implementing paste
thru-hole technology?  We have a multipin connector we would like to reflow
instead of solderwave.  Any comments or pointers would be greatly
appreciated.

Donn Steffen
Wk# (219)925-8887
Fax# (219)925-8710
Email: [log in to unmask]

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