Maybe this info will help.  Yes, I know, I've posted it before.  Jack
IPC-7525 Stencil Design Guidelines

This new document provides guides for the design and fabrication of stencils for solder paste and surface-mount adhesive.  This is the first time this important information has been collected and published in an industry consensus document.  Stencil design for various surface-mount technology, as well as mixed technology with through-hole or flip chip components is discussed; this includes overprint, two-print and step stencil designs.  A sample order form and a user inspection checklist are also included.

20 pages
Release Date:  May 2000

Prices (IPC Members):
Hardcopy - $15
Electronic version:
Single-User - $23

Prices (Nonmembers):
Hardcopy - $30
Electronic version:
Single-User - $46

>>> "Steffen, Don E" <[log in to unmask]> 06/08/00 01:26PM >>>
TECHNET

Does anybody have stencil/process design guidelines for implementing paste
thru-hole technology?  We have a multipin connector we would like to reflow
instead of solderwave.  Any comments or pointers would be greatly
appreciated.

Donn Steffen
Wk# (219)925-8887
Fax# (219)925-8710
Email: [log in to unmask] 

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