We have recently started using boards with V-score for the panelization and
we have a debate raging here.  There is a concern about separating the
boards before versus after the incircuit test and whether there is the
possibility that there is imparted stress to the board that could create a
failure mechanism that might have been caught at the ICT and not at the
functional test, thus the requirement to singulate before versus after ICT.
I have read various articles, but am wondering what people have found in
the real world.

Thanks

Ed Holton
Manufacturing Engineer and Group Leader
Hella Electronics
Telephone (734) 414-0944
Fax (734) 414-0941

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