Ha Ha Ha, That's funny! I sure feel for you man. Like Steve mentioned
already, we have all been there before. I once had a customer tell us that
running parts upside down a second time through the reflow oven degraded the
reliability of the solder joints. He demanded that we use a low temp solder
for the second reflow so the first joints wouldn't be reflown twice.
Luckily, while we were debating whether to fight or comply, colleagues from
his own company set him straight, and we didn't have to use low temp solder.
Like many have already said, the flash gold on the bare board does nothing
for corrosion resistance on the finished product. Reworking the boards will
actually lower the reliability of the product. (Poetic justice I think).
Although, I think if you keep trying, you might be able to educate the
customer enough to accept the good boards.
Gook Luck!
Ryan Grant
Advanced Technology Engineer
MCMS
(208) 898-1145
[log in to unmask]
> -----Original Message-----
> From: Ralph Richart [SMTP:[log in to unmask]]
> Sent: Thursday, June 08, 2000 10:55 AM
> To: [log in to unmask]
> Subject: [TN] still confused
>
> We have answers....
>
> So I had a long talk with my customer this morning to provide input
> based on the invaluable advice from you all.
>
> I said - "is there a specific reason for choosing 3-8u" of immersion
> gold over tin/lead solder?"
> He said - "absolutely, the gold provides corrosion resistance, the gold
> does not"
> I said - "even such a thin amount - only 3-8u"?"
> He said - "definitely, all we need is the coverage, the thickness is
> irrelevant"
>
> Is this true?
>
> Needless to say, we are rebuilding the parts as we speak. Rework sounds
> difficult to say the least, although I may try to come up with some
> scheme for fun as they have a bunch of boards that are no good right
> now.
>
> thanks for all the help.....
>
> ralph
>
> PS - more on the larrylobster story later; it's more silly than anything
> else. Paul's poem may soon become our own, however. Very funny!
>
> Off to build some boards....
>
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