Ralph,
If they think immersion gold will provide corrosion resistant, have them
shelf one for 6 mos. to a year and see if it will solder...
Rick

>-----Original Message-----
>From:  Kenneth Kirby [SMTP:[log in to unmask]]
>Sent:  Thursday, June 08, 2000 11:26 AM
>To:    [log in to unmask]
>Subject:       Re: [TN] still confused
>
>
>
>
>This doesn't make any sense.  Unless you are going to solder the parts on
>with gold you will still have tin/lead solder exposed after reflow or wave.
>
>???????
>Ken
>
>
>
>
> (Embedded
> image moved   Ralph Richart <[log in to unmask]>
> to file:      06/08/2000 11:55 AM
> pic21044.pcx)
>
>
>
>
>To:   [log in to unmask]
>cc:    (bcc: Kenneth Kirby/ElectrovertUS/Cookson)
>Subject:  [TN] still confused
>
>
>
>
>We have answers....
>
>So I had a long talk with my customer this morning to provide input
>based on the invaluable advice from you all.
>
>I said - "is there a specific reason for choosing 3-8u" of immersion
>gold over tin/lead solder?"
>He said - "absolutely, the gold provides corrosion resistance, the gold
>does not"
>I said - "even such a thin amount - only 3-8u"?"
>He said - "definitely, all we need is the coverage, the thickness is
>irrelevant"
>
>Is this true?
>
>Needless to say, we are rebuilding the parts as we speak.  Rework sounds
>difficult to say the least, although I may try to come up with some
>scheme for fun as they have a bunch of boards that are no good right
>now.
>
>thanks for all the help.....
>
>ralph
>
>PS - more on the larrylobster story later; it's more silly than anything
>else.  Paul's poem may soon become our own, however.  Very funny!
>
>Off to build some boards....
>
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> << File: pic21044.pcx >>

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