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June 2000

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Subject:
From:
Alain Savard <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 8 Jun 2000 13:09:06 -0400
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-----Original Message-----
From: Ralph Richart [mailto:[log in to unmask]]
Sent: June 8, 2000 12:55 PM
To: [log in to unmask]
Subject: [TN] still confused


We have answers....

So I had a long talk with my customer this morning to provide input
based on the invaluable advice from you all.

I said - "is there a specific reason for choosing 3-8u" of immersion
gold over tin/lead solder?"
He said - "absolutely, the gold provides corrosion resistance, the gold
does not"
I said - "even such a thin amount - only 3-8u"?"
He said - "definitely, all we need is the coverage, the thickness is
irrelevant"

Is this true?

Needless to say, we are rebuilding the parts as we speak.  Rework sounds
difficult to say the least, although I may try to come up with some
scheme for fun as they have a bunch of boards that are no good right
now.

thanks for all the help.....

ralph

PS - more on the larrylobster story later; it's more silly than anything
else.  Paul's poem may soon become our own, however.  Very funny!

Off to build some boards....

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