Eric,

I have found that the Hepco products are fantastic.  We have a Model 1800-1
for radial components and TO-92 transistors and a Model 8000-1 for axial
lead components. These machines have been reliable and huge time savers.

Hepco, Inc.
150 San Lazaro Ave.
Sunnyvale, CA 94086
ph: 408-738-180
fx: 408-732-4456

Regards,

Phil Nutting
Manufacturing Engineer
Kaiser Systems, Inc.
126 Sohier Road
Beverly, MA 01915
ph: 978-922-9300
fx: 978-922-8374
[log in to unmask]


-----Original Message-----
From: Eric Kalgren [mailto:[log in to unmask]]
Sent: Thursday, June 08, 2000 12:06 PM
To: [log in to unmask]
Subject: [TN] Lead Forming and Component Placement Questions


Hey all,

I've just been given  instructions to research and reccomend the purchase of
lead forming equipment (both TH and SM) and TH component placement
equipment.  Does anyone have any suggestions or comments on different types
of equipment. (Following all the rules of TN that people have been blasted
over recently!)

I also have questions about tinning components with respect to automated
lead forming.  Is tinning usually done before or after lead forming?  We are
working high rel and several of our contracts still spec NHB5300 and
MIL2000, so a blanket "No-tin" directive will not be acceptable to our
customers and quality folks.  I am actually also working on developing a
reliable (read repeatable) method of tinning as our assemblers are doing it
by hand currently.  (suggestions on this are welcome as well).

Thanks in advance,


Eric Kalgren
BFGoodrich Aerospace
Space Flight Systems
[log in to unmask]
(505) 938-5139

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