Hey all, 

I've just been given  instructions to research and reccomend the purchase of lead forming equipment (both TH and SM) and TH component placement equipment.  Does anyone have any suggestions or comments on different types of equipment. (Following all the rules of TN that people have been blasted over recently!)

I also have questions about tinning components with respect to automated lead forming.  Is tinning usually done before or after lead forming?  We are working high rel and several of our contracts still spec NHB5300 and MIL2000, so a blanket "No-tin" directive will not be acceptable to our customers and quality folks.  I am actually also working on developing a reliable (read repeatable) method of tinning as our assemblers are doing it by hand currently.  (suggestions on this are welcome as well).

Thanks in advance, 


Eric Kalgren
BFGoodrich Aerospace
Space Flight Systems
[log in to unmask]
(505) 938-5139

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