Ralph,

Do they need Immerison Au surface for a wire bonded chip on board?  If so, I
would suggest  using a very small interface board for the chip instead of
trying to plate on a built up board... I would rather walk a mine field in
Bosnia, less unknowns and gottchas.

Regards, Bruce Misner

> ----------
> From:         Ralph Richart[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Ralph Richart
> Sent:         Wednesday, June 07, 2000 7:28 PM
> To:   [log in to unmask]
> Subject:      [TN] Loaded board rework
>
> Hello:
>
> Our customer made a mistake on their print.  Instead of specifying
> immersion gold, they specified Hot Air Solder Levelled.  Now they have
> LOADED boards that they want to get immersion gold on.
>
> Has anyone done this?  The questions I have off the top of my head are:
> 1. How do you protect the components from the immersion gold?  Would
> conformal coat work?
> 2. Do you have to strip the solder first, or can you go gold over
> solder?
> 3. What, if anything, would all this do to reliability?
>
> Thanks for your help....
>
> ralph richart
>
> ##############################################################
> TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
> ##############################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in
> the body:
> To subscribe:   SUBSCRIBE TECHNET <your full name>
> To unsubscribe:   SIGNOFF TECHNET
> ##############################################################
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information.
> If you need assistance - contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> ##############################################################
>

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################