Phil,
Lucent no long has a board fabrication shop. We sold our Richmond factory
years ago and they are now Viasystems. They do supply lots of our immersion
silver boards but we also have at least 4 other shops (some in asia) that
supply us with immersion silver boards. Also we receive our immersion
silver boards packaged the same way we receive all our boards (i.e., shrink
wrapped 10 to a package).
Regards,
George
George M. Wenger DMTS
Bell Laboratories Princeton, Supply Network Solutions
Engineering Research Center FMA / AQA / RCA Lab
(609) 639-2769 (Office); 3210 (Lab); 2343 (Fax)
[log in to unmask]
-----Original Message-----
From: Phil Crepeau [mailto:[log in to unmask]]
Sent: Wednesday, June 07, 2000 3:32 PM
To: [log in to unmask]
Subject: Re: [TN] Immersion White Tin
hi,
here's the reply. i'm not sure what this means other than that the boards
need to be bagged in a non-silver tarnish container. i believe the threat
of silver migration is mitigated by its extreme thinness. i have the
feeling that these people at lucent are fabbing their own pwb's in-house.
it still looks like a good candidate for an evaluation. if there are more
messages related to this, i'll pass them on.
phil
-----Original Message-----
From: Wenger, George M (George) [mailto:[log in to unmask]]
Sent: Wednesday, June 07, 2000 10:49 AM
To: [log in to unmask]
Subject: Re: [TN] Immersion White Tin
Darrel,
We think IAg is different that the thick silver plating that is used on
components. The IAg thickness on our boards is about 6 microinches thick.
It will tarnish extensively (i.e., turn back in color) if exposed to sulfur
so we don't expose it to S and if it does get exposed we don't use the
boards.
Most people miss the reason we use IAg. We are not using it as a solderable
surface!. We are using it as a visual inspection to know that the copper
features should be solderable (i.e., if the copper features change from a
copper color to a silver color during IAg plating than the copper wasn't
contaminated with solder mask residue or tin-strip residue from the board
fabrication process.
Regards,
George
George M. Wenger DMTS
Bell Laboratories Princeton, Supply Network Solutions
Engineering Research Center FMA / AQA / RCA Lab
(609) 639-2769 (Office); 3210 (Lab); 2343 (Fax)
[log in to unmask]
-----Original Message-----
From: Darrel Therriault [mailto:[log in to unmask]]
Sent: Wednesday, June 07, 2000 10:16 AM
To: [log in to unmask]
Subject: Re: [TN] Immersion White Tin
At 10:39 AM 6/7/00 -0400, you wrote:
>[log in to unmask]
George,
Thanks for a very insightful synopsis of IWT. I recall many years back
that silver plated ICs caused solder problems
due to tarnishing. Is IAg different from that problem?
Thanks again for the info. Very helpful.
Regards.....DT
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