George,
Thanks for the link. I'll check it out tomorrow after I get some sleep
tonight. I appreciate your input on this subject.
For what it's worth I spoke to another industry guru this afternoon and he
felt that Asia is looking towards tin, but the US market is leaning towards
silver. He also mentioned a new OSP that is coming out from Electro
Chemical. Supposed to be thinner, and easier to test thru for those thin
baords.
Hmmmmm
CG
----- Original Message -----
> Message-ID:
<[log in to unmask]>
> From: "Wenger, George M (George)" <[log in to unmask]>
> To: "[log in to unmask]" <[log in to unmask]>
> Subject: RE: [TN] Immersion White Tin
> Date: Wed, 7 Jun 2000 21:26:33 -0400
>
> CG,
> their web site address is www.aesf.org and their phone number is
> 407-281-6441. I hope that helps.
>
> Regards,
>
> George
> George M. Wenger DMTS
> Bell Laboratories Princeton, Supply Network Solutions
> Engineering Research Center FMA / AQA / RCA Lab
> (609) 639-2769 (Office); 3210 (Lab); 2343 (Fax)
> [log in to unmask]
>
>
> -----Original Message-----
> From: [log in to unmask] [mailto:[log in to unmask]]
> Sent: Wednesday, June 07, 2000 4:54 PM
> To: Wenger, George M (George)
> Subject: RE: [TN] Immersion White Tin
>
>
> George,
>
> Thank you for the information. I would be very interested in attending
> SurFin 2000 on June 28, where can I find information on this event? I
don't
> see anything on this in my industry calendar.
>
> CG
>
> On Wed, 7 Jun 2000 10:39:57 -0400 , Wenger, George M (George) wrote:
>
> > Circuitgrrl,
> >
> > As one of the "Big Boys" who puts their reputation on the line every
time
> a
> > new technology is implemented on product, risk doesn't discourage us
nor
> do
> > we "put our head in the sand". We prefer to make data driven
"knowledge
> > based" decisions.
> >
> > In 1996 we determined a need for a flat solderable surface finish.
We
> had
> > extensive experience with OSP's and had shown that periodic
solderability
> > busts are a concern since board fabrication contamination issues
couldn't
> be
> > seen prior to component placement and surface mount assembly. Up to
this
> > time our participation in consortia activities associated with surface
> > finishes indicated that there wasn't an "ideal" finish that was as
flat
> as
> > OSP copper and as solderable as SnPb HASL. The "Gray" immersion tin
> products
> > available were flat but their solderability degraded rapidly when
exposed
> to
> > moist heat. As a result, the only available candidates were immersion
> gold
> > over electroless nickel (IAuENi) and immersion silver (IAg). The
> evaluation
> > methodology we used and the results which lead us to chose IAg as our
> > surface finish of choice were presented at the IPC Third Annual
National
> > Conference: A Summit on Surface Finishes and PWB Solderability in
Irvine,
> CA
> > on September 23, 1999. An update of these evaluations will be
presented
> at
> > SurFin 2000 in Chicago, IL on June 28, 2000.
> >
> > The "White" immersion tin surface finish was not included in our 1996
-
> 1998
> > evaluations because it wasn't readily available and we had already
> > implemented IAg into production in 1997. Because of supply chain
> > considerations (i.e., not every board vendor offers every surface
finish)
> > we've run a production trial of surface finishes available from our
board
> > vendors. Although the "White" immersion tin results were markedly
better
> > than the evaluations we made earlier with "Gray" immersion tin, the
> > immersion tin did not perform as well as immersion silver. Our
current
> > surface finish of choice continues to be immersion silver.
> >
> > Regards,
> >
> > George
> > George M. Wenger DMTS
> > Bell Laboratories Princeton, Supply Network Solutions
> > Engineering Research Center FMA / AQA / RCA Lab
> > (609) 639-2769 (Office); 3210 (Lab); 2343 (Fax)
> > [log in to unmask]
> >
> >
> > -----Original Message-----
> > From: [log in to unmask] [mailto:[log in to unmask]]
> > Sent: Thursday, June 01, 2000 4:45 PM
> > To: [log in to unmask]
> > Subject: Re: [TN] Immersion White Tin
> >
> >
> > The immersion white tin we have seen requested is Omikron by Florida
> CirTech
> > and I have heard of Dexter and Alphametal producing an immersion white
> tin.
> > Supposedly assemblers are moving to the IWT because it is more
reworkable
> > than OSP, the surface co-planarity is good and so is the
solderability.
> >
> > We're trying to determine where the industry is going, is anyone else
> seeing
> > this happen?
> >
> >
> >
> > On Thu, 1 Jun 2000 13:38:45 -0700 , Brooks Bill wrote:
> >
> > > This is going to date me... I used to manufacture boards in my
youth,
> we
> > > used electroless tin as a coating for boards where heavy
> hydro-squeegee
> > > solder coating was not required... Is this what you mean by white
tin
> > > immersion?
> > > -Bill Brooks
> > >
> > > -----Original Message-----
> > > From: [log in to unmask] [mailto:[log in to unmask]]
> > > Sent: Thursday, June 01, 2000 12:18 PM
> > > To: [log in to unmask]
> > > Subject: [TN] Immersion White Tin
> > >
> > >
> > > I hope to generate some discussion on this subject, since there
wasn't
> > much
> > > from last weeks questions on immersion white tin...
> > >
> > > We (as a PCB fabricator) have had several inquiries about immersion
> white
> > > tin from our customers, but we don't see any of the large OEM's
making
> a
> > > move towards it.
> > > Any opinions out there?
> > >
> > >
> > >
> > >
> > >
> > >
> > >
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