The items that they want to be gold are actual features on the board, not edge
connectors or anything like that.

I don't know why they want gold rather than solder.  I can only assume that it has
something to do with the environment or application.  But, I would guess that tin/lead
could withstand as much as 3-8u" of gold.

 The boards are already populated, so I assume it's not a planarity issue.

ralph

"Howieson, Rick" wrote:

> Ralph,
> Ain't gonna happen and why would they want this?
> Rick
> GTC
>
> >-----Original Message-----
> >From:  Ralph Richart [SMTP:[log in to unmask]]
> >Sent:  Wednesday, June 07, 2000 5:29 PM
> >To:    [log in to unmask]
> >Subject:       [TN] Loaded board rework
> >
> >Hello:
> >
> >Our customer made a mistake on their print.  Instead of specifying
> >immersion gold, they specified Hot Air Solder Levelled.  Now they have
> >LOADED boards that they want to get immersion gold on.
> >
> >Has anyone done this?  The questions I have off the top of my head are:
> >1. How do you protect the components from the immersion gold?  Would
> >conformal coat work?
> >2. Do you have to strip the solder first, or can you go gold over
> >solder?
> >3. What, if anything, would all this do to reliability?
> >
> >Thanks for your help....
> >
> >ralph richart
> >
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