TECHNET Archives

June 2000

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Immersion White Tin
From:
Darrel Therriault <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 7 Jun 2000 08:15:43 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (29 lines) 
At 10:39 AM 6/7/00 -0400, you wrote:
>[log in to unmask]



George,

Thanks for a very insightful synopsis of IWT.  I recall many years back
that silver plated ICs caused solder problems
due to tarnishing.  Is IAg different from that problem?

Thanks again for the info.  Very helpful.

Regards.....DT

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2