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June 2000

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Subject:
From:
"Ingemar Hernefjord (EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 7 Jun 2000 15:49:13 +0200
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Short q: Ag/Ni/Cr, what do you like that chip backsides for attaching power FETs? Ag is 90%.  Unusual? IRC make such backside metalizing. Wonder why...I'm somewhat concerned, Ag migration and strange intermetallics may occur, depending on what solder or glue you use. Anyone mounting these creeps? Steve?
Ingemar Hernefjord
Ericsson Microwave Systems

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