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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 30 Jun 2000 10:11:16 +0100 |
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Hi Terry,
TI publish a useful "Palladium Finish User's Manual" which may give you
more information on palladium lead finish on components. According to
this, the finish is as follows (viewed with Cu leadframe at bottom of
list/outer layer at top):
Palladium min 3u" (0.075micron)
Nickel Plate 40 - 60u" (1.0 - 1.5micron)
Palladium/Nickel Strike max 5u" (0.125micron)
Nickel Strike max 5u" (0.125micron)
Cu. Base Leadframe
The key role of the palladium is to protect the underlying layer of
nickel from oxidation during storage/assembly. The palladium dissolves
into the solder joint, and these joints can look significantly
different to those made to a solder dip finish leadframe.
The exact role of the underlying Palladium/Nickel Strike and Nickel
Strike layers I am not sure. Perhaps other TechNet Minds can advise?
Hope this helps,
Clive ffitch
Matra BAe UK
Stevenage, England
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]
Sent: 27 June 2000 08:51
To: [log in to unmask]
Cc: [log in to unmask]
Subject: [TN] Palladium query
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Fellow TechNetters,
Can someone please enlighten me as to the purpose of a Palladium
Barrier on
components / PCBs.
Best regards
Terry Exell
BAE SYSTEMS, Plymouth, UK
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