I wouldn't call 45'C as bake Richard,
(i'd rather select a laminate which does not need a bake)
being just about standard summer store temperature here in Sydney,
but i can tell it meets with zilch(0)effect,
even as low as 3umNi & 0.2umAu wets fine after a year.
Used to work in places where the stores generated 60'C in shade,
no effect. Admittedly sealed boards would passivate differently in open air,
however never encountered this practically on gold (did on silver and tin)
Mist of Aqua Regia could make a difference if we'd try hard enough,
down town Mexico City smog composition could in theory substitute.

Also, after 7 months on 20-100'C cycling the pads were solderable with
little if any wetting shit,
even with flux resin dried to caramel on previous handsolder,
I'd say you can sleep easy with oven on.

paul

-----Original Message-----
From: Richard Tilbrook [mailto:[log in to unmask]]
Sent: Tuesday, 20 June 2000 18:31
To: [log in to unmask]
Subject: Re: [TN] Ag on Ni - effect of baking


Hi technetters,
I'm hoping to find out a bit more about the effect of baking (at 45 deg. C)
on
boards with gold on nickel.
I would be grateful for any info on the sibject, including times,
temperatures and
effects, such as passivation.

Thanks,

Richard TIlbrook

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