Can someone tell me if there is a better way to call out a solderable
material finish for a simple formed spring finger which is intended to be
soldered using standard solderpaste/reflow processing?  These are very
similar to emi gasketing for doors, but I've never had to solder them down
before.

"Material:  0.003" thick Beryllium copper (BeCu) alloy 25 per ASTM B194.
Finish: Bright Tin per Mil-T-10727."

I don't have a lot of familiarity with either spec and need to know what
the rest of the industry would use in this situation.  I'm a little
concerned about the use of the MIL Spec and also the wetting to the exposed
edges of beryllium copper as the springs will be made in bulk and then
singulated after plating.

These will function as the grounding contact between a board and a chassis.

Thanks,

Phil

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################