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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 22 Jun 2000 09:54:21 -0700 |
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We have found some internal fab defect (cracking at one of the inner layer)
which we don't know is due to assembly process or fab process induced.
If I were to create a Thermal shock profile to precipitate defect on a
loaded board How can I come out with? I have decided to use -10C to +70C, 10
minutes soaks, +/-20C/minute ramps, 12 cycles which will give a test
duration approx. 3.6 hours.
Any comments will be highly appreciated. All the failed one were found
during ICT testing hence decided to send all lot.
re,
Ken Patel
______________________________________________________
Ken Patel Phone: (408) 490-6804
1708 McCarthy Blvd. Fax: (408) 490-6859
Milpitas, CA 95035
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