Dear Brian, dear all,
Brian wrote:
WHOA!
This is publicity pure and simple and is not permissible.
You are quite right, but on the other hand, the site contains a lot of technical data about the TI Ni/Pd and Ni/Pd/Au lead-free finishes. I at least, was happy to find this update. I would like to use the occasion to add some technical discussion to the
application of Ni/Pd and Ni/Pd/Au solderable finishes of IC terminations.
Nickel and palladium are environmentally very hostile metals, nickel because of its health implications for humans and palladium and gold because of the extremely large ECO-impact of mining (palladium two to three orders of magnitude, and gold two orders
of magnitude larger than mining of lead). Why then this finish? Let me present my personal opinion on that.
At the time that this finish was developed, palladium was relatively cheap. The finish was glueable, bondable, mouldable and solderable. By applying it as a pre-plated leadframe, the IC packagers were able to skip the galvanic off-line SnPb
treatment and perform a real flow process. That was their big economic advantage, which made them push this finish, although its solderability is less good than that of SnPb and the resistance to shock and vibration is still questionable to me.
Later, when lead-free became an issue, it was realised quickly that this finish was lead-free; a new, additional argument to promote its application. In the meantime its price rose to astronomical levels, which makes today's economic
profitability questionable. However, it is not a one day's work to change back to the old production process.
In a short ECO-impact study (using the ECO-impact 95 method), which we performed in the framework of the BRITE/EURAM project "IDEALS", it appeared that nickel, gold and palladium are extremely hostile to the environment (see above), so much that
the Ni/Pd and Ni/Pd/Au platings are one to two orders of magnitude worse for the environment than a conventional SnPb20 metallisation with a thickness of 5-10 micrometer on IC leads.
To translate a Dutch saying literally: "This medicine is far worse than the desease.", looking from an environmental perspective. No wonder that I keep saying that a thorough ECO-impact study should be performed for all metals applied in
lead-free alternatives, i.e. Sn, Pb, Ag, Cu, Ni, Bi, Zn, Sb, Pd, Au, Pt and maybe a few more. This should be a real systematic Life Cycle Assessment (LCA) from ores in the ground to waste and recycling/disposal, taking into account all kinds of aspects,
such as impairment of ECO systems, emission of CO2, SO2, heavy metals etc., health impairments, exhaust of natural resources, etc, etc.. As long as that has not been done, it is impossible to determine whether lead-free soldering in electronics is really
benificial to the environment, and to determine the most ECO-friendly alternatives. (The recent contributions to this problem (e.g. Laura Turbini's article in the IEEE conference May ' 00, San Francisco proceedings ) are very valuable, but do by far not
cover the whole issue.)
Regards,
Erik
----------------------------------------------------------------------------------------------------------------------------------
Erik E. de Kluizenaar
Philips CFT - Electronic Packaging & Joining (EP&J)
Building SAQ-p, p/o box 218, 5600 MD Eindhoven - The Netherlands
Tel/Fax: (+31 40 27) 36679/36815; E:mail [log in to unmask]
PHILIPS worldwide homepage: http://www.philips.com
Internal PHILIPS only: http://pww.cft.philips.com/cfteurope/electronics/elpajo/index.htm
-----------------------------------------------------------------------------------------------------------------------------------
[log in to unmask]@[log in to unmask] on 2000/06/28 10:20:28 AM
Please respond to [log in to unmask]@SMTP
Sent by: [log in to unmask]
To: [log in to unmask]@SMTP
cc:
Subject: Re: [LF] Texas Instruments Lead-Free Solutions - Web Page
Classification: Restricted
WHOA!
This is publicity pure and simple and is not permissible.
Brian
"Romm, Doug" wrote:
>
>
> For anyone interested, you can view the TI Lead-Free
> Solutions Web Page at the following link:
> http://www.ti.com/sc/leadfree
> Of couse the contents of this page will be updated as new
> information becomes available.
> Regards,
> Doug Romm
>
################################################################
Leadfree E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask]
with following text in the body:
To subscribe: SUBSCRIBE Leadfree <your full name>
To unsubscribe: SIGNOFF Leadfree
###############################################################
Please visit IPC's Center for Lead-Free Electronics Assembly
(http://www.leadfree.org ) for additional information.
For technical support contact Keach Sasamori [log in to unmask] or 847-790-5315.
################################################################
################################################################
Leadfree E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask]
with following text in the body:
To subscribe: SUBSCRIBE Leadfree <your full name>
To unsubscribe: SIGNOFF Leadfree
###############################################################
Please visit IPC's Center for Lead-Free Electronics Assembly
(http://www.leadfree.org ) for additional information.
For technical support contact Keach Sasamori [log in to unmask] or 847-790-5315.
################################################################
|
