In a message dated 06/16/2000 1:01:25 PM Central Daylight Time,
[log in to unmask] writes:
<< Guys,
It was told to us by our assembly house that PTH/component lead ratio is too
tight for good solder fillet and to avoid solder depression (hole is not
being completely filled up). I can see there is no de-wetting either on wall
or the pin after cross-section.
I want to know what that magic number should be. I believe that clearance or
the gap between pin and hole - what is the minimum clearance recommenced and
what should be maximum clearance for better solder fillet.
Is this information available on any IPC document? I have read it but can't
remember now.
re,
ken patel >>
Hi Ken!
The rule of the thumb that I've always used is the finished hole size should
be
.015 - .020" larger than the lead diameter. That takes autoinsertion into
account
as well...
-Steve Gregory-
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