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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 16 Jun 2000 08:08:00 -0600 |
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Ron,
We have been using direct metalization for 5 years now. It has been
accepted by the Department of Defense and NASA. You should be able to
get technical data from Shipley or ElectroChemical.
Rick
>-----Original Message-----
>From: Ronald Yanuszewski [SMTP:[log in to unmask]]
>Sent: Thursday, June 15, 2000 5:45 PM
>To: [log in to unmask]
>Subject: [TN] Direct Metalization
>
>All:
>
>One of our PCB suppliers would like us to qualify their direct metalization
>process, Shipley-Ronal Conductron. Being from the not so young school of
>electroless, I have not embraced the direct plate process. Any opinions,
>test data or anecdotal information as to the pros and cons would be greatly
>appreciated.
>
>Ron
><!DOCTYPE HTML PUBLIC "-//W3C//DTD HTML 4.0 Transitional//EN">
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><META content="text/html; charset=iso-8859-1" http-equiv=Content-Type>
><META content="MSHTML 5.00.2614.3500" name=GENERATOR>
><STYLE></STYLE>
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><BODY bgColor=#ffffff>
><DIV><FONT face=Arial size=2>All:</FONT></DIV>
><DIV> </DIV>
><DIV><FONT face=Arial>One of our PCB suppliers would like us to qualify their
>direct metalization process, Shipley-Ronal Conductron. Being from the
>not
>so young school of electroless, I have not embraced the direct plate
>process. Any opinions, test data or anecdotal information as to
>the
>pros and cons would be greatly appreciated.</FONT></DIV>
><DIV> </DIV>
><DIV><FONT face=Arial>Ron</FONT></DIV></BODY></HTML>
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