Why is it the lower the applied voltage across the anode and cathode the
better in an acid copper plating bath. It seems that the throwing power
is greater, but I am not sure? P=VI I is fixed the lower the I, means
the lower the power drawn. What does it do with the throwing power? How
about in a Tin-lead plating bath? We are using the Rapid power supplies
and the Macdermid 9241 plating bath.
THANKS IN ADVANCE!!!!!!
Francis
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################